STIRRI-LF-993 Sn99.3Cu0.7-0.5 mm 0.020 inch no-clean lead-free eutectic solder wire 2.5% NC-core - 100g spool (ROL0) - for soldering electronics, sensitive devices

Features

• Exhibits excellent thermal and electrical conductivity, making it well-suited for industrial electronic applications. The addition of copper enhances strength and ductility, making it an ideal choice for demanding environments. Its composition facilitates better control over the manufacturing process, ensuring consistent quality in the solder joint
• Alloy Composition: Made of 99.3% Tin (Sn) and 0.7% Copper (Cu), this alloy combines strength with excellent thermal cycling capabilities. The copper content improves mechanical properties, enhancing joint reliability and reducing the risk of thermal fatigue. It also promotes better wetting characteristics, increases resistance to corrosion, and improves adhesion to surfaces. The lower eutectic melting point makes it easier to work with
• The eutectic melting and solidifying point is approximately 227C, making this wire suitable for lead-free temperature profiles designed for industrial-grade optimal performance. (*LIQ and SOL temperature range as per IPC J-STD-006B)
• No-Clean Flux Core: Contains 3.3% rosin-based no-clean flux core for excellent wetting, minimal residue, and ease of use, ensuring clean and efficient soldering.
• Certified Compliance: Meets IPC J-STD-006B standards for quality and performance, making it a preferred choice for lead-free soldering in medical devices and automotive industries, lead-free electronics assembly and repair. Convenient small spools for quick practical use.