STIRRI-LF-307 STIRRI-LF-307 Sn99Ag0.3Cu0.7-0.8 mm 0.031 inch no-clean lead-free solder wire 3.3% NC-core - 100g spool (ROL0) - for soldering electronics

Features

• Excellent Mechanical Properties: SAC307 Provides strong solder joints that can withstand thermal and mechanical stress. Good Thermal and Electrical Conductivity: Ensures efficient performance in electronic applications. Resistance to Thermal Cycling: Performs well under conditions of temperature fluctuations.
• Alloy Composition: Made of 99% Tin (Sn), 0.3% Silver (Ag) and 0.7% Copper (Cu), this alloy combines strength with good thermal cycling capabilities
• Classic LF temperature points: melting approximately at 221C and solidifying around 217C, this wire is nearly eutectic responding well to the most lead-free temperature profiles. (*LIQ and SOL temperature range as per IPC J-STD-006B)
• No-Clean Flux Core: Contains 3.3% rosin-based no-clean flux core for excellent wetting, minimal residue, and ease of use, ensuring clean and efficient soldering.
• Certified Compliance: Meets IPC J-STD-006B standards for quality and performance, making it a preferred choice for lead-free soldering in medical devices and automotive industries, lead-free electronics assembly and repair. Convenient small spools for quick practical use.