Sn99 /Ag0.3 /Cu0.7, Lead Free Solder Paste No Clean, 217℃ Melting Point (5ML)
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You can check the price history of Sn99 /Ag0.3 /Cu0.7, Lead Free Solder Paste No Clean, 217℃ Melting Point (5ML) here.
Product Information
Details
| Product Name | Sn99 /Ag0.3 /Cu0.7, Lead Free Solder Paste No Clean, 217℃ Melting Point (5ML) |
|---|---|
| Store Product Code | B0GTZ4SNF4 |
| Store Name | amazon.com |
| Rating | 9.2 / 10 |
| Category | Solder |
| Product Manufacturer | TANG HONG |
| Model Number | Solder Paste-1 |
| Dimensions | 5 x 1 x 1 inches |
Features
- Solder Paste Content: Sn99/Ag0.3/Cu0.7, Sloder Flux Content: 12%
- Lead-Free Solder Paste Gross Weight: 0.57 oz / 16 g (Syringe)
- Paste Features: No Clean, Strong Viscosity, Bright Welding Point
- Product Advantages: Pushing design for Smoother Flowing, No Waste During Welding
- High-Temperature Solder Paste, Melting Point: 217C (423F)
- Applications: Widely Used In Circuit Board, IC, Phone, TV and Other Household Appliances and Industrial Equipment
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Rating and Reviews
9.2 Based on 92 reviews
Sn99 Ag0.3 Cu0.7 Lead Free Solder Paste has 9.2 rating out of 10. This average rating is consist of 92 individual ratings. You can rate this product at product review page.
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