Based our analysis and observation, there is 66.19% chance that the price of Solder Sucker with Precision Nozzle Manual Desoldering... will increase. Price of product might fluctuate around 3% from current price.*
Price History Graph
Offer PricePrices
Lowest: -
Average: -
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Price History Information
You can check the price history of Solder Sucker with Precision Nozzle, Manual Desoldering Pump for Electronics Repair, Circuit Board Rework and DIY Soldering Projects here. This product's current Price in USA is $16.19. The average and highest prices are $15.42 and $20.29 respectively.
Lowest Ever Price
$13.19
18th Mar 2026
Average Price
$15.42
Based on 133 days price tracking
Highest Price
$20.29
9th Jun 2026
Current Price in USA
Price
$16.19
Recent Price Drops on Solder Sucker with Precision Nozzle, Manual Desoldering Pump for Electronics Repair, Circuit Board Rework and DIY Soldering Projects
Price Drop17th Jul 2026
$17.23→$16.19
6.04% drop
Price Drop25th Jun 2026
$20.29→$17.89
11.83% drop
Product Information
Details
Product Name
Solder Sucker with Precision Nozzle, Manual Desoldering Pump for Electronics Repair, Circuit Board Rework and DIY Soldering Projects
Store Product Code
B0CS5WZ851
Store Name
amazon.com
Rating
10 / 10
Category
Desoldering Pumps
Product Manufacturer
YWBL-WH
Model Number
YWBL-WH50x7wrqoc3
Features
Efficient Suction: Solder sucker uses vacuum technology to remove solder quickly and cleanly from PCBs during repair work, with 4.5 inch length and 0.8 oz weight enabling precise handheld control, ensuring clean joints without residue for reliable rework outcomes
Non Static Design: Solder sucker built with ESD safe materials prevents static discharge when handling microelectronics, featuring industrial grade plastic housing that resists heat up to 392F, protecting sensitive ICs and traces during repeated desoldering sessions
Heat Resistant Body: Solder sucker body withstands sustained thermal exposure near soldering irons, made from flame retardant plastic measuring 1.2 inch diameter and 4.5 inch length, offering stable grip and low fatigue during extended bench use
Complete Solder Removal: Powerful suction clears molten solder fully from through holes and surface mount pads, achieving consistent 0.04 inch nozzle inner diameter seal, reducing bridging risks and supporting repeatable electrical continuity
Precision Nozzle: Tapered tip targets single solder joints without contacting nearby components, shaped for optimal vacuum seal on standard 0.02 to 0.06 inch pads, improving accuracy during fine pitch IC and QFP rework
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* Predictions is created on based of past prices and trends, it does not guarantee that it will happen. These are just prediction for theoretical information only.