Lead-Free Solder Balls,BGA Lead‑Free Solder Ball Tin Balls 25W for PCB Board Rework Reballing Accessories 0.55MM

Features

• [ High-Purity Lead-Free Solder Balls for BGA Rework ] These SAC305 (Sn96.5%/Ag3%/Cu0.5%) solder balls are specifically formulated for professional BGA (Ball Grid Array) rework and reballing. They are environmentally friendly, RoHS compliant, and designed to create reliable, high-strength electrical connections on PCBs
• [ Precision 0.55mm Diameter for Consistent Results ] Each solder ball is manufactured to a precise diameter of approximately 0.55mm (0.02 inches). This consistent size ensures uniform melting, proper ball formation, and reliable alignment during the reballing process for chips with fine-pitch BGA packages
• [ Enhanced Oxidation Resistance & Solderability ] The alloy composition includes trace elements that significantly improve the solder balls' resistance to oxidation. This enhancement ensures better shelf life, cleaner melts, and stronger, more reliable solder joints with excellent wetting characteristics on pads
• [ High-Volume 250,000 Count for Demanding Projects ] Packed in a convenient bottle, this bulk quantity of 250,000 solder balls provides ample material for extensive repair work, prototyping, or production needs. Its a cost-effective solution for repair shops, electronics manufacturers, and serious hobbyists
• [ Essential for BGA Repair, Reballing & Prototyping ]An indispensable accessory for repairing or replacing damaged BGA chips, performing component upgrades, or for prototyping new PCB designs. It is suitable for use in smartphones, laptops, gaming consoles, and other advanced electronic devices