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High Temperature Solder Paste No Clean Rework
11th Jul 2026, 02:37 AM

High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece

Price may vary by location, shipping cost, and availability.
87% Off
$11.84
$89.99

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Highest: $11.91
Average: $9.93
Lowest: $6.36

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Based our analysis and observation, there is 50.60% chance that the price of High Temperature Solder Paste No Clean Rework... will increase. Price of product might fluctuate between 4% and 8% of current price.*

Price History Graph

Offer Price Prices
Lowest: -
Average: -
Highest: -

Price History Information

You can check the price history of High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece here. This product's current Price in USA is $11.84. The average and highest prices are $9.93 and $11.91 respectively.

Lowest Ever Price $6.36
12th Mar 2026
Average Price $9.93
Based on 136 days price tracking
Highest Price $11.91
21st Jun 2026

Current Price in USA

Price $11.84
MRP $89.99
Savings $78.15
Discount 86.84%

Recent Price Drops on High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece

Price Drop 28th Jun 2026
$11.91 → $10.33
13.27% drop

Product Information

Details

Product Name High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece
Store Product Code B0BCC9FTGH
Store Name amazon.com
Rating 10 / 10
Category Solder
Product Manufacturer FTVOGUE

Features

  • [HIGH TEMPERATURE PERFORMANCE] Designed as a high temperature solder paste with strong affinity to the soldering iron tip helping support stable rework and repair tasks across more maintenance situations.
  • [NO CLEAN FORMULA] Features a no clean flux design that is easy to operate and helps simplify the soldering process making it convenient for electronics repair work without extra cleaning steps.
  • [FULL TIN JOINTS] Made with tin material to deliver full solder coverage small and white solder joints while containing no strong corrosive substances such as fluorine for dependable use.
  • [ELECTRONICS REPAIR USE] Mainly intended for tin planting in mobile phone repair and BGA tin planting in computer maintenance making it suitable for chip level electronics and circuit board rework.
  • [STORAGE NOTE] Store with care and do not keep below 0 because thawing can affect the rheological properties of the solder paste helping preserve handling consistency before use.

Images

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Image of High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece
Image of High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece
Image of High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece
Image of High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece
Image of High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece
Image of High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece
Image of High Temperature Solder Paste, No Clean Rework Flux for Circuit Board Repair Tin Planting Tin Material 1 Piece

Rating and Reviews

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High Temperature Solder Paste No Clean Rework has 10 rating out of 10. You can rate this product at product review page.

* Predictions is created on based of past prices and trends, it does not guarantee that it will happen. These are just prediction for theoretical information only.
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