You can check the price history of BGA, Tin Solder Ball, Soldering Heat Universal Stencil Balls(9 size) here. This product's current Price in USA is $32.09. The average and highest prices are $31.74 and $32.09 respectively.
Lowest Ever Price
$31.39
7th Mar 2026
Average Price
$31.74
Based on 138 days price tracking
Highest Price
$32.09
13th Mar 2026
Current Price in USA
Price
$32.09
MRP
$119.99
Savings
$87.90
Discount
73.25%
Product Information
Details
Product Name
BGA, Tin Solder Ball, Soldering Heat Universal Stencil Balls(9 size)
Store Product Code
B09FPW6QGQ
Store Name
amazon.com
Rating
8.2 / 10
Category
Solder
Product Manufacturer
Miskall
Model Number
Miskallr0dgvy5sez-04
Size
9 size
Dimensions
3.94 x 1.97 x 1.97 inches
Features
DURABLE MATERIAL-- This Lead-free tin solder ball 100% brand new and high quality, durable material for a long time use.
APPLICATION-- These tin balls are used for connection of semiconductor chip, circuit module and PCB board.
USEFUL FOR YOUR SOLDERING WORK-- They are quite small and can transmit electronic signal, very useful for your soldering work.
MEET YOUR BASIC NEED-- Each bottle contains about 25000 solder balls that will meet your basic need.
MANY DIFFERENT SIZES-- There are many different sizes you can choose, and you can choose 9 bottles to get them all.
Images
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Rating and Reviews
8.2Based on 13 reviews
BGA Tin Solder Ball Soldering Heat Universal has 8.2 rating out of 10. This average rating is consist of 13 individual ratings. You can rate this product at product review page.
* Predictions is created on based of past prices and trends, it does not guarantee that it will happen. These are just prediction for theoretical information only.