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BGA Tin Solder Ball 9 Bottles 0.3-0.76mm
19th Jul 2026, 02:15 PM

BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module

Price may vary by location, shipping cost, and availability.
Lowest in last 4 months
64% Off
$25.29
$69.99

Highest: $25.29
Average: $25.29
Lowest: $25.29

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Based our analysis and observation, there is 0.00% chance that the price of BGA Tin Solder Ball 9 Bottles 0.3-0.76mm... will increase. Price of product might fluctuate around 3% from current price.*

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Price History Information

You can check the price history of BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module here. This product's current Price in USA is $25.29. The average and highest prices are $25.29 and $25.29 respectively.

Lowest Ever Price $25.29
4th Mar 2026
Average Price $25.29
Based on 139 days price tracking
Highest Price $25.29
4th Mar 2026

Current Price in USA

Price $25.29
MRP $69.99
Savings $44.70
Discount 63.86%

Product Information

Details

Product Name BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module
Store Product Code B0DDSFT2TF
Store Name amazon.com
Rating 9.2 / 10
Category Solder
Product Manufacturer KooingTech
Model Number tin solder ball820

Features

  • Product specifications: Each bottle contains about 25,000 tin solder balls, 0.3-0.76mm, including 9 sizes, to meet your basic welding needs, with good practicability
  • Function: Reballing stencils to connect semiconductor wafers and circuit template machine PCB board, transmit electronic to ultra small tin electronic parts
  • Professional Manufacturing: BGA bead add trace elements, improve the oxidation resistance and reliability of the tin ball, to provide effective service for your welding work
  • Easy to Operate: Reballing stencils operation is simple, can be directly welded, suitable for PCB board GPU CPU IC chip circuit module connection
  • Tips: The larger the BGA solder ball model, the larger the particles, the more in the bottle, on the contrary, the smaller the model, the less in the bottle, 0.76mm is full bottle

Images

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Image of BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module
Image of BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module
Image of BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module
Image of BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module
Image of BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module
Image of BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module
Image of BGA Tin Solder Ball, 9 Bottles 0.3-0.76mm Reballing Stencils, BGA Solder Bead for PCB Board GPU CPU IC Chip Circuit Module

Rating and Reviews

9.2 Based on 6 reviews

BGA Tin Solder Ball 9 Bottles 0.3-0.76mm has 9.2 rating out of 10. This average rating is consist of 6 individual ratings. You can rate this product at product review page.

* Predictions is created on based of past prices and trends, it does not guarantee that it will happen. These are just prediction for theoretical information only.