BGA Solder Ball Reballing Soldering PCB Heat Universal Stencil Balls (0.6mm)
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Product Information
Details
| Product Name | BGA Solder Ball Reballing Soldering PCB Heat Universal Stencil Balls (0.6mm) |
|---|---|
| Store Product Code | B0BY8NSR66 |
| Store Name | amazon.com |
| Rating | 10 / 10 |
| Category | Solder |
| Product Manufacturer | Marukio |
| Dimensions | 3.94 x 1.97 x 1.97 inches |
Features
- Features:They Are Quite Small And Can Transmit Electronic .
- Material:Made Of High Quality Material And To Use. 100 Brand New And High Quality.
- 100 Brand New And High Quality.
- This Tin Solder Ball 100 Brand New And High Quality, Material For A Long Time Use.
- These Tin Balls Are Used For Connection Of Semiconductor Chip, Circuit Module And Pcb Board.
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